12-inch PECVD equipment to achieve localization

Recently, the "90-65nm Plasma Enhanced Chemical Vapor Deposition (PECVD) Equipment R&D and Application" project, which was deployed in the major national science and technology major project "Very Large Scale Integrated Circuit Manufacturing Equipment and Complete Technology", was successfully completed, and domestically produced 12-inch PECVD equipment was realized. It has filled the domestic gap and improved the overall competitiveness of China's integrated circuit industry.

PECVD equipment is one of the core equipment for integrated circuit manufacturing. It is technically difficult and has high single-unit value. The 12-inch PECVD technology has been monopolized by countries in the United States, Europe, and Japan. With the deployment and support of major national science and technology projects, the joint research and development of enterprises and scientific research institutes have overcome the architectural platform design of 12-inch PECVD equipment, thin film process development, theoretical simulation calculations, equipment reliability and process repeatability, and film uniformity. For key technologies such as sex control and radio frequency technology, 307 patents were applied and 10 technical standards were established. The 12-inch plasma enhanced chemical vapor deposition (PECVD) equipment (PF-300) won the national key new product. The product passed the production verification, purchase certification and use of 12-inch wafer manufacturing by SMIC and Suzhou Chip, Huajin Semiconductor, and Huatian Technology. The indicators have reached the international level, and the cost is 70 for international equipment. %. At present, the project has achieved sales of 7 sets of 12-inch PECVD, and 5 other devices have been delivered to users, and the products and services have been unanimously approved by users.

May 03, 2016 Source: Ministry of Science and Technology